SmartCase IC Packaging Centersupply@smartcase.suZelenograd, Russia
SmartCase
OSAT / ATMP center

Powering the final mile of chip manufacturing!

A trusted partner for contract IC assembly, testing, marking and packaging — from prototype to volume production.

10 000ICs tested per shift
2021year founded
100%quality control
SmartCase
360°full-cycle ATMP
About SmartCase

Engineering precision in every package

SmartCase brings together semiconductor experts with extensive hands-on experience. We support a broad device range — from microcontrollers and memory to complex mixed-signal ICs.

  • IC assembly and packaging
  • Automated functional testing
  • Prototype and high-volume production
About the company →
Capabilities

End-to-end production cycle

Integrated solutions that turn bare semiconductor die into reliable, tested, application-ready products.

Electrical measurement
01

Electrical measurement

Electrical parameter measurement on wafers

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Wafer cutting into die
02

Wafer cutting into die

High-precision diamond blade wafer dicing.

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Die attach
03

Die attach

Precise placement and secure die attachment.

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How it works

From bare die to finished device

01

Requirements

Volumes, package and technical requirements.

02

Preparation

Process flow and test program.

03

Assembly

Attach, interconnect and encapsulation.

04

Testing

Electrical and functional verification.

05

Delivery

Marking, packing and shipment.

Ready to take your product into volume production?

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